$75m CHIPS Act cash for glass substrates
The last days of the Biden administration in the US has seen an award of $75m to Absolics confirmed for manufacturing of glass substrates for AI chiplet packaging.
Absolics, a subsidiary of Korean firm SKC, is building a 120,000 square-foot facility in Covington, Georgia, for the development of substrates technology for use in semiconductor advanced packaging. These glass substrates will be used to increase the performance of leading-edge chips for AI and high-performance compute and data centres by reducing power consumption and system complexity.
“With the stable securing of funding, we will be able to proceed smoothly with the planned commercialization of the glass substrates. We will continue to promote research and development to maintain a technological edge based on our glass substrate technology,” said a SKC Spokesperson.
There is also $77m funding for semiconductor equipment maker Entegris for construction of its manufacturing centre in Colorado Springs, Colorado, which is targeted to begin initial commercial operations in 2025. The plant will initially support production of liquid filtration products, as well as Front-Opening-Unified Pods (FOUPs) for handling semiconductor wafers.
“We are pleased to receive this important funding to help strengthen the U.S. semiconductor industry infrastructure,” said Entegris President and Chief Executive Officer Bertrand Loy. “This further expands our ability to meet the critical needs of our customers while contributing back to the local economy in Colorado Springs.”
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