800G optical transceiver directly connects to multi-core fibre
Hyper Photonix, in collaboration with its group company SiPhx Inc., Japan, has developed an 800G optical transceiver that can be directly connected to FUJIKURA multi-core fibre (MCF) with two duplex LC connectors.
With the increasing demand for AI, large-scale machine learning systems require an extensive network of GPU interconnections. This is leading to a significant rise in the optical fibre infrastructure necessary for the backend connectivity of AI clusters. However, traditional single-core optical fibres have scalability and space efficiency limitations.
Multi-core fibre (MCF) integrates several cores within a single cladding, addressing the limitations of single-core fibres. For instance, a four-core MCF can replace four individual single-core fibres with one fibre, effectively reducing the overall fibre volume in data centres and significantly enhancing space utilisation. However, traditional optical transceivers require an external fan-in/fan-out (FIFO) assembly device to connect to MCF fibres, which in turn requires space.
To address this, Hyper Photonix has developed an MCF-compatible transceiver by integrating its proprietary Hyper Silicon™ technology and successfully embedding the FIFO micro-assembly directly into the optical transceiver module. This innovation eliminates the need for external FIFO devices, enabling direct MCF connectivity while enhancing network simplicity, space efficiency, and operational performance.
Hyper Silicon™ is a proprietary silicon photonics integration platform that uses advanced optical designs to produce high-performance optical engines at the lowest cost per bit. It is suitable for both PAM and coherent optical chips and integrates multiple optical functions in a single chip.
Looking ahead, Hyper Photonix is accelerating the development of next-generation 1.6T and 3.2T MCF optical transceivers, targeting a market release in 2025. These advancements aim to meet the growing optical connectivity demands of next-generation AI clusters while providing cutting-edge optical communication that enhances data centre efficiency.
Hyper Photonix, in collaboration with its group company SiPhx Inc., Japan, has developed an 800G optical transceiver that can be directly connected to FUJIKURA multi-core fibre (MCF) with two duplex LC connectors.
With the increasing demand for AI, large-scale machine learning systems require an extensive network of GPU interconnections. This is leading to a significant rise in the optical fibre infrastructure necessary for the backend connectivity of AI clusters. However, traditional single-core optical fibres have scalability and space efficiency limitations.
Multi-core fibre (MCF) integrates several cores within a single cladding, addressing the limitations of single-core fibres. For instance, a four-core MCF can replace four individual single-core fibres with one fibre, effectively reducing the overall fibre volume in data centres and significantly enhancing space utilisation. However, traditional optical transceivers require an external fan-in/fan-out (FIFO) assembly device to connect to MCF fibres, which in turn requires space.
To address this, Hyper Photonix has developed an MCF-compatible transceiver by integrating its proprietary Hyper Silicon™ technology and successfully embedding the FIFO micro-assembly directly into the optical transceiver module. This innovation eliminates the need for external FIFO devices, enabling direct MCF connectivity while enhancing network simplicity, space efficiency, and operational performance.
Hyper Silicon™ is a proprietary silicon photonics integration platform that uses advanced optical designs to produce high-performance optical engines at the lowest cost per bit. It is suitable for both PAM and coherent optical chips and integrates multiple optical functions in a single chip.
Looking ahead, Hyper Photonix is accelerating the development of next-generation 1.6T and 3.2T MCF optical transceivers, targeting a market release in 2025. These advancements aim to meet the growing optical connectivity demands of next-generation AI clusters while providing cutting-edge optical communication that enhances data centre efficiency.
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