80V automotive power MOSFETs save space with dual-device packages
LFPAK56D is fully automotive qualified to AEC-Q101. Its copper clip gull wing package technology offers board level reliability in thermally demanding applications such as engine management, transmission control and ABS systems. The parts package two isolated MOSFETs in one Power-SO8. The LFPAK56D occupies 77% less PCB space than two DPAK’s or 50% less space than a single Power-SO8 device, offering significant savings in space, weight and cost. 80V technology extends Nexperia’s LFPAK family of gull wing, copper clip devices in LFPAK56, LFPAK56D and LFPAK33.
NXP adds that, in the LFPAK56D package, thermal stresses on PCB solder joints are absorbed resulting in excellent board level reliability; the combination of internal and external package features suits the LFPAK56D for engine management systems. LFPAK56D is typically used in applications such as solenoid control, motor control and DC/DC power conversion, with the 80V portfolio specifically aimed at engine management and LED lighting applications.
Nexperia; www.nexperia.com/automotivemosfets/lfpak56d
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