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There are 3370 results for 3d-packaging

First 15V trench MOSFET in a PQFN package
First 15V trench MOSFET in a PQFN package
New Products | - By Nick Flaherty
...by around 30 percent, and FOMQ OSS by half by lowering the breakdown voltage. By minimizing conduction and switching…
Anglia moves into Europe
Anglia moves into Europe
Business news | - By Nick Flaherty
...packaging, with environmental packaging with no logos so customers can use the packaging, and we use paper tape rather…
Next-Generation Microelectronics Manufacturing
Next-Generation Microelectronics Manufacturing
News | - By Wisse Hettinga
...integration (3DHI). Given the agency’s expectation that future innovation hinges on the fusion of diverse materials, devices, and circuits…
International Semiconductor Alliance launches for European chip packaging
International Semiconductor Alliance launches for European chip packaging
Business news | - By Nick Flaherty
...cleared to create chip packaging plant CIL to add PCB assembly as it completes chip packaging move In addition,…
Siemens buys EDA firm to improve design for reliability
Siemens buys EDA firm to improve design for reliability
Business news | - By Peter Clarke
...articles: www.siemens.com www.insighteda.com News articles: Imperas updates RISC-V models, verification and tools Siemens launches Tessent tool for Verilog and…
China’s YMTC sues Micron over 3D-NAND patents
China’s YMTC sues Micron over 3D-NAND patents
Business news | - By Peter Clarke
...China’s YMTC confirms lead in 3D NAND flash memory Advanced logic, memory, YMTC come under China export controls Micron…
Molex expands manufacturing with campus in Poland
Molex expands manufacturing with campus in Poland
Business news | - By Jean-Pierre Joosting
...devices. The site will have state-of-the-art capabilities, including advanced medical device assembly, packaging, drug handling and injection molding. Additionally,…
Molex opens $110m plant in Poland
Molex opens $110m plant in Poland
Business news | - By Nick Flaherty
...advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power…
ThinKom in regional jet antenna terminal production deal
ThinKom in regional jet antenna terminal production deal
Business news | - By Jean-Pierre Joosting
...drag, packaging, and power constraints,” said Bill Milroy, ThinKom’s Chief Technology Officer. “The Ka1717 terminal excels across these key…
CIL to add PCB assembly as it completes move to UK cleanroom
CIL to add PCB assembly as it completes move to UK cleanroom
Business news | - By Nick Flaherty
Custom Interconnect Ltd (CIL) has completed its transfer of all microelectronics and power device staff and equipment into its…


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