MENU

There are 14 results for wafer-bonding

AI boost for CMOS image sensors with three layer integration
AI boost for CMOS image sensors with three layer integration
Technology News | - By Nick Flaherty
CEA-Leti in France has developed a process for combining hybrid bonding and high density through-silicon vias (TSVs) to add AI…
Researchers develop low-cost, high-efficiency photonic IC
Researchers develop low-cost, high-efficiency photonic IC
Technology News | - By Jean-Pierre Joosting
The team was able to fabricate high-efficiency lithium tantalate photonic ICs with an optical loss rate of just 5.6 dB/m…
3D-NAND flash explores beyond 300 layers at VLSI Symposium
3D-NAND flash explores beyond 300 layers at VLSI Symposium
Technology News | - By Peter Clarke
3D-NAND flash non-volatile memory is covered by several papers at the upcoming 2023 Symposium on VLSI Technology and Circuits. The…
Rapidus joins imec Core Partner Programme for 2nm development
Rapidus joins imec Core Partner Programme for 2nm development
Business news | - By Nick Flaherty
imec in Belgium has reinforced its position as the leading semiconductor process technology development research labs in a 2nm deal…
High precision metrology for 3D heterogeneous packaging
High precision metrology for 3D heterogeneous packaging
New Products | - By Nick Flaherty
The EVG40 NT2 from the EV group provides breakthrough measurements for wafer- and die-level hybrid bonding and maskless lithography…
Mastering service cuts nanoimprint litho costs 
Mastering service cuts nanoimprint litho costs 
Business news | - By Nick Flaherty
The Step-and-Repeat (S&R) Mastering Shop by EVG allows designerse to develop nanoimprit lithography masks quickly and cost effectively…
Siemens and ASE extend 3D packaging
Siemens and ASE extend 3D packaging
Technology News | - By Nick Flaherty
Siemens and ASE are developing a single platform from 2.5D and 3D packaging to Fan-Out wafer-level packaging (FOWLP) technologies…
Thin substrate enables world’s smallest Bluetooth module
Thin substrate enables world’s smallest Bluetooth module
Technology News | - By Nick Flaherty
A thin PCB substrate from AT&S in Austria is enabling the world’s smallest Bluetooth module.
New OLED architecture has 10,000 PPI resolution
New OLED architecture has 10,000 PPI resolution
Technology News | - By Ally Winning
Researchers at Samsung in Korea and Stanford University in the US have developed and patented a new architecture for OLED…
Samsung files patent for ultra-high res VR display
Samsung files patent for ultra-high res VR display
Technology News | - By Nick Flaherty
Researchers at Samsung in Korea and Stanford University in the US have developed and patented a new architecture for OLED…
  • 1
  • 2


10s