ACF bonding technology for ADAS systems

ACF bonding technology for ADAS systems

New Products |
By Christoph Hammerschmidt

ACF bonding is used to make the interconnection between the front-facing camera and the data processing PCB. Bonding systems can also be used for other automotive tasks, including parking/reversing, night vision, drowsiness monitors, distance warning/autonomous emergency braking, and blind spot detection.

The ACF bond joins parts both electrically and mechanically with glue containing conductive particles. By applying precise heat, force, and time, as well as ensuring careful parts alignment, ACF bonding systems make a strong and reliable electrical-mechanical interconnection.

The ACF bonding process works well for fine-pitch camera interconnection applications, which can be under 30 micron, because of the small particle size. It is also cheaper than ZIF connectors. The lead-free and flux-free process can make electrical-mechanical connections to glass substrates or fine-pitch PCB circuits.

Amada Miyachi Europa uses pulsed heat technology with close loop controls for ACF bonding. The UNIFLOW4 power supply provides the targeted heating and precision temperature control necessary. An external MG3 digital weld monitor is used to monitor all process parameters. The MG3 provides precision real-time dynamic measurement of all the welding variables. It offers the tools required for process development, production monitoring, data collection, and analysis to support ISO, GMP and TQM requirements.

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