HLMC is one of China’s more advanced wafer fabs and has 55, 40 and 28nm CMOS manufacturing processes and is capable of producing up to 35,000 wafers per month.
Crocus Nano Electronics LLC is a back-end of line (BEOL) fab formed by Crocus Technologies SA (Grenoble, France) with financial support from Rusnano, the Russian state investment fund for nanotechnology (see Crocus senses flex in flexible displays). It initially worked with Crocus on magnetic RAMs.
Adesto’s was founded in 2006 to commercialize CBRAM technology although it has also sold more conventional non-volatile memories.
Now the three companies intend to combine CBRAM with HLMC’s 55nm CMOS, and CNE’s back-end processing to build embedded and stand-alone ReRAM components.
Adesto argues that 55nm is a sweet spot for low-power platforms for IoT edge nodes with the ability to execute-in-place. In 55nm the use of CBRAM requires fewer masks than alternatives.
“We anticipate ramping quickly to production in 55nm and are also exploring a potential roadmap for even more advanced nodes,” said Jack Qi Shu, executive vice president at HLMC, in a statement.
“CNE’s primary focus is on innovative NVM technologies including MRAM and RRAM, and we are ready to work with our customers to achieve market success with products based on Adesto’s proven CBRAM technology,” said Vladimir Krupnik, vice president of business development at CNE, in the same statement. “We are already seeing a great deal of customer interest in this technology for RFID and MCU applications and believe there are many other areas where the technology can provide advantages.”
Adesto’s Mavriq and Moneta memory families, which have been in the market for a number of years, are both based on CBRAM technology.
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