Increasingly high-performance microprocessors and ASICs require brief bursts of high current demand that is typically well in excess of normal system operation. This burst-mode or peak-power capability eliminates the need for a second converter module to be placed in parallel.
The BMR458 is aimed at system architects developing equipment for Information and Communication Technology (ICT) applications, including datacoms and server and storage systems. The module is ideal for high-power applications that are powered by multi-cell batteries or rectifiers commonly used in the ICT industry and employ intermediate bus conversion (IBC) or dynamic bus voltage (DBV) architectures.
“This upgrade of the BMR458 meet the needs of leading customers to handle peak current, commonly demanded by the latest system processors, ASICs and other system-on-chip devices,” said Martin Hägerdal, Head of Ericsson Power Modules. “Once again, Ericsson has extended its technological leadership with this further augmentation of capabilities to deliver the most advanced and highest power capable advanced bus converter available on the market today.”
The module provides 650W controlled via the PMBus, reducing the number of required modules in very high power applications; and highly accurate current sharing, as well as it being the only advanced bus converter available today to offer active- or droop-current sharing. Other key features including dynamic load compensation, snapshot parameter capture, and a PMBus v1.3 interface.
Key electrical characteristics include class-leading high efficiency of up to 96.6% at half load and 96.3% at full load; maximum current output of 54.2A; tightly regulated 12V output (+/–2mV, typical) across the 40 to 60V input voltage range; output current monitoring of +/-1A to enable highly accurate system monitoring capability; and a fast transient recovery time of only 1ms. Further specifications include: an MTBF of 8.2 million hours; and I/O functional isolation of 2250Vdc, which meets the latest IEC/EN/UL60905 safety standard.
The module measures 57.9 x 36.8 x 12.7 mm (2.28 x 1.45 x 0.5in) and is available with an optional baseplate, enabling connection to a heatsink or cold plate for the most extreme environments.