Advantest further expands T2000 test platform
The new 1.6 Gbps digital module features a Functional Test Abstraction Plus (FTA+) function. It allows a protocol-oriented test during which the tester platform communicates with the DUT in the latter one’s protocol. A powerful EDA link (FTA-Link) connects the design simulator directly to the T2000 test platform. In addition, the module allows Verilog code to be executed on the T2000 Enhanced Performance Package. Since the tester pattern generator features protocol-oriented functions which support independent storage and timing functions, protocol-based I/O processes can be measured directly. Thus, users can conduct very efficient multi-site and parallel tests. This, in turn, enables users to speed their design-to-tapeout and reduce time to market.
The 1.6GDM features a vector mode which makes it fully compatible with existing Advantest 1.6GDM digital modules; at the same time this feature increases throughput and reliability.
The T2000 Enhanced Device Power Supply (DPS150AE) module enables users to conduct very exact tests of high-current as well as of low-voltage semiconductors. Examples are microprocessor units (MPUs), ASICs and FPGAs. The module expands the T2000’s platform capability for multi-site tests at high component throughput and thus helps reducing test costs.
The module is available either as field-upgradable package or as an option for the T2000 EPP (Enhanced Performance Package) system and increases test flexibility. The module’s high speed bus capability and its Advantest Smart Test Condition Memory (TCM), the T2000 EPP supports module splitting in which a single module can test multiple DUTs in parallel. Each of these devices can be monitored and assessed separately. In addition, the new module allows for faster setting and adjustment of the test condition via TCM. This function loads all parameters of a test program beforehand and contains a modify function which enables test engineers to change those settings anytime.
The DPS150AE is equipped with eight high current channels which can provide currents of up to 16A. In addition it has, eight low current channels with an output current of up to 2.66A. Multiple channels can be switched in parallel. Thus, up to 80 HC channels can be coupled, enabling currents of up to 1280A for high-current components.
Both new modules will be available beginning August.
Related links and articles:
Multiprotocol tool boosts productivity in SSD testing
MCU goes SOC – Changes in Microcontrollers and Testers Equipment
RF module tester address wide-modulation challenges
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
