AEC-Q101 Trench 9 MOSFETs in rugged packaging

AEC-Q101 Trench 9 MOSFETs in rugged packaging

New Products |
By Christoph Hammerschmidt

Nexperia (Nijmegen, The Netherlands), formerly the Standard Products division of NXP has added a series of Trench 9 power MOSFETs, targeted primarily at the automotive industry, which combine low voltage superjunction technology with advanced packaging, combining performance and ruggedness. The Trench 9 devices are all qualified to AEC-Q101, and exceed the requirements of this international automotive standard by as much as a factor of two, on key reliability tests including temperature cycling, high temperature gate bias, high temperature reverse bias and intermittent operating life.

LFPAK56E is an enhanced version of the LFPAK56 package, with an optimised lead frame and package design that results in an improvement in RDS(on) and power density of up to 30%. This improvement in power density enables the Trench 9 LFPAK56 MOSFETs to be used in applications previously only possible with D2PAK and D2PAK-7, delivering significant PCB space-savings.

The superjunction technology offers an improved avalanche and SOA (safe operating area) capability when compared to competing technology ensuring critical devices survive even in fault conditions. Traditionally – Nexperia asserts – most suppliers won’t recommend TrenchMOS technologies for single shot or repetitive avalanche applications. However, Trench 9 has been designed to offer single shot and repetitive avalanche performance for demanding application and fault conditions, and its datasheets include single-shot and repetitive avalanche ratings.

Nexperia comments, “To facilitate autonomous driving, automotive manufacturers are requesting dual-redundant circuits for many critical applications such as power steering and braking. The challenge for tier 1 subsystem suppliers is to add the additional power components to their modules without increasing the overall PCB or module size. The combination of our Trench 9 superjunction technology with our LFPAK56 and LFPAK56E packaging capability gives a performance and reliability advantage, and the reduction in footprint allows … dual-redundancy without significantly increasing the total PCB area.”

Anticipated applications include brushed and brushless motor control for power steering, transmission control, ABS, ESC, pumps (water, oil and fuel), fan speed control, reverse battery protection and DC/DC converters.




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