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Agile Analog joins TSMC Open Innovation Platform IP Alliance Programme

Agile Analog joins TSMC Open Innovation Platform IP Alliance Programme

Business news |
By Nick Flaherty



Uk startup Agile Analog has joined the TSMC IP Alliance Programme to offer its complete range of  IP  to TSMC customers.

The deal is key for Cambridge-based Agile Analog as it uses its in-house tool Composa to generate custom analog and power IP for data conversion, power management, security, IC monitoring, and always-on-domains. The announcement follows a similar deal with Intel’s forthcoming 2nm foundry services.

“Our OIP membership enables us to better serve our growing array of global customers, especially those in the areas of AI and HPC working on the most advanced nodes,” said Barry Paterson, CEO at Agile Analog.

The TSMC IP Alliance includes major IP companies from across the world and provides the semiconductor industry’s most comprehensive catalogue of silicon-verified and production-proven IP for TSMC process technologies. The TSMC OIP ensures the optimal design experience, easiest design reuse and fastest integration to accelerate innovation in semiconductor design.

“We are delighted to be joining such an elite group of global IP companies in the TSMC IP Alliance. In recent years we have delivered IPs on a variety of TSMC processes for customers,” said Chris Morrison, Director of Product Marketing at Agile Analog.

“As part of the OIP ecosystem, we can now access the PDKs and bring our entire analog IP portfolio to TSMC process technologies – from high power BCD nodes to standard planar nodes, and the latest advanced process technologies.”

“Our products are being used for novel applications across a wide-range of sectors, including; automotive, AI, High Performance Computing (HPC), and IoT. Demand for data conversion and power management solutions is extremely high at the moment, so we expect our ADC, DAC, and LDO products in particular will help to drive semiconductor innovation.”

“TSMC values design ecosystem partners and continues working with them to enable next-generation designs with the full spectrum of best-in-class solutions benefiting from TSMC’s industry leading technologies,” said Dan Kochpatcharin, Head of the Design Infrastructure Management Division at TSMC. “Together with IP partners like Agile Analog, we’re able to help our mutual customers overcome design complexity and introduce new electronic innovations into the market more quickly.” 

www.agileanalog.com

 

 

 

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