
AI dev platform for time series IoT endpoint applications
The Time Series EOS S3AI development platform is offered as providing all the hardware blocks needed to enable low-power AI at the IoT endpoint. It comes with time-series (continuous) sensors – including accelerometer/gyroscope/magnetometer motion sensors and two digital microphones (PDMs) – and includes seamless hooks to the SensiML Analytics Toolkit for sensor applications requiring time series (continuous) data analysis.
This platform approach is designed to speed system-level design and implementation, improve bandwidth, power, latency and security, while reducing costly and time-consuming resources needed to deploy AI-based IoT solutions. The EOS S3AI platform solution, says the company, is ideal for endpoint applications, such as predictive maintenance, structural health monitoring, context awareness for wearables, and manufacturing process control.
“The Industry 4.0 initiative calls for predictive maintenance and automation in manufacturing and industrial settings,” says Sam Massih, director of product management at QuickLogic. “Our new EOS S3AI platform featuring the SensiML Analytics Toolkit, will further accelerate the adoption of AI in motors, bearings, and manufacturing equipment. Our customers win by getting the ease-of-use and flexibility they need to get to market quickly without the need for large teams of data scientists or firmware engineers, which are typically required in the AI space.”
The platform uses the SensiML Analytics Toolkit to efficiently identify which complex feature extraction algorithms are ideal for the labeled data sets and generates the AI models and classifiers using machine learning techniques for code development. The AI model that is subsequently generated is uniquely optimized to fit in the EOS S3AI hardware blocks (eFPGA, uDSP and M4) and are programmed by the SensiML Toolkit. The tight integration of hardware and software ensures that the AI algorithms are optimized for the EOS S3AI platform, enabling low power and efficient endpoint processing with the help of hard accelerators and eFPGA feature extraction algorithms.
The EOS S3AI platform, says the company, allows the OEM to lower system and operating costs and improve reliability by eliminating the need for continuous high-bandwidth connectivity, and because the platform enables AI endpoint solutions to be developed easily and quickly with minimal data science and firmware engineering resources, endpoint application customers will benefit from lower product development costs and gain time-to-market advantages.
The EOS S3AI platform and the SensiML Analytics Toolkit are available now.
