AI power chipset enables high efficiency, small solution size
The MAX16602 AI cores dual-output voltage regulator and the MAX20790 smart power-stage IC are designed to enable designers of high-performance, high-power artificial intelligence (AI) systems achieve the highest efficiency (to reduce power cost and heat) and smallest total solution size.
“The real estate for AI power solutions is becoming limited while the need to provide high power density in a pre-designed small space is more critical,” says Steven Chen, director of business management for the Cloud and Data Center Business Unit at Maxim Integrated. “As a result, designers need a scalable solution to customize their design objectives. This multi-phase AI power chipset by Maxim Integrated powers AI hardware accelerators such as GPUs, FPGAs, ASICs and xPUs to increase solution efficiency and reduce solution size for different form factors such as PCIe and OAM.”
Leveraging the current ripple cancellation benefit from the company’s patented coupled inductor, the AI multi-phase chipset provides a one percent efficiency improvement compared to competitive solutions, enabling greater than 95 percent efficiency at 1.8V output voltage and 200A load conditions. Furthermore, says the company, this increase in efficiency translates to a 16 percent reduction in wasted power, and also allows 40 percent less output capacitance compared to competitive solutions, reducing total solution size and capacitor count.
The chipset provides a scalable solution for various output current requirements and is customizable to support multiple form factors. In addition, the chipset enables AI computing at the edge as well as cloud computing at the datacenter.
Key advantages of the chipset are offered as the following:
- Highest Efficiency/Lowest Heat and Power Dissipation: Maxim Integrated’s patented coupled inductor technology reduces switching frequency by 50 percent, allowing for 1 percent higher efficiency
- Smallest Total Solution Size: A decrease in solution size is achieved by reducing output capacitance by 40 percent and providing a solution with lower phase count compared to competitive solutions
- Flexible: Solution is scalable from 2 to 16 phases for different output current requirements (thermal design current is typically 60A to 800A or more); Low profile (<4mm) coupled inductor is customizable to support multiple form factors such as peripheral component interconnect express (PCIe) and OCP accelerator modules (OAM)
The MAX16602 and MAX20790 are available now with pricing on request. An evaluation kit – the MAX16602CL8EVKIT – is available for both products.
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