The agreement covers technical collaboration and establishes capacity at UMC for Allegro’s proprietary automotive-grade power and sensor technologies, supporting the strong long-term growth projections of Allegro. This follows a deal in 2012 where Allegro transferred its technologies to UMC’s manufacturing facilities.
“We wanted a partnership that would help us expand Allegro’s business and portfolio. UMC has been extremely successful in satisfying the technology, quality, and production needs of our customers,” said Thomas Teebagy, Senior Vice President of Operations and Quality at Allegro. “UMC has the capacity and technology to accommodate Allegro’s projected growth and increasing wafer shipment requirements.”
Allegro has previously ported its ABCD4 and ABCD6 processes to UMC and will continue to port its own processes under the new agreement. Currently, the two companies are developing Allegro’s A10S and A10P 0.18μm BCD technologies as well as supporting custom integration with GMR and TMR magnetoresistive sensors.
“UMC’s sustained effort towards developing robust specialty and automotive technologies has enabled us to become a foundry leader in automotive IC production, with AEC-Q100 qualified processes backed by manufacturing that complies with rigorous ISO TS-16949 automotive quality standards for all UMC fabs,” said Bruce Lai, Vice President of 8″ Operations at UMC. “We value our long-standing partnership with Allegro to produce their automotive ICs, and we are pleased to extend our cooperation through this new agreement to support their future growth requirements and help enhance their market position.”
Allegro has a technical and marketing centre in Heidelberg in Germany as well as an engineering design centre in Edinburgh in Scotland and a technical and marketing centre in Annecy in France.