Alphawave Semi shows 3nm PCIe 6.0 silicon IP
AlphaWave Semi is showing its IP for 112G Ethernet and PCIe 6.0 silicon on TSMC’s latest 3nm (N3E) process technology for chiplets.
The ZeusCORE Extra-Long-Reach (XLR) 1-112Gbps NRZ/PAM4 serialiser-deserialiser (SerDes) IP has been used for a live demonstration of the latest PCI Express and high speed Ethernet standards for data centre applications.
The 3nm process platform is crucial for the development of a new generation of advanced chips needed to cope with the exponential growth in AI-generated data, and enables higher performance, enhanced memory and I/O bandwidth, and reduced power consumption.
ZeusCORE XLR Multi-Standard-Serdes (MSS) IP is the highest performance SerDes in the Alphawave Semi product portfolio and on the 3nm process will pave the way for the development of future high performance AI systems. It is a highly configurable IP that supports all leading edge NRZ and PAM4 data centre standards from 1112 Gbps, supporting diverse protocols such as PCIe Gen1 to Gen6 and 1G/10G/25G/50G/100 Gbps Ethernet.
The connectivity IP is being combined with Alphawave Semi’s chiplet-enabled custom silicon platform which includes IO, memory and compute chiplets, allows end-users to produce high performance silicon specifically tailored to their applications.
Designers can use the IP subsystems and 2.5D/3D packaging expertise to integrate advanced interfaces such Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), High Bandwidth Memory (HBMx), and Low-Power Double Data Rate DRAM (LP/DDRx/) onto custom chips and chiplets.
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“We are thrilled to be one of the first companies to successfully demonstrate our highest performance silicon platform with our XLR 112G Ethernet and PCIE6.0 SerDes IP on TSMC’s most advanced 3nm technology,” said Tony Pialis, CEO and co-founder of Alphawave Semi which moved its headquarters to London in 2021.
“This represents a significant step forward in our execution of Alphawave Semi’s strategy to be a vertically integrated semiconductor leader in high-speed connectivity. Thanks to our rapidly growing partnership with TSMC through the Open Innovation Platform (OIP), we continue to deliver innovative, high-performance custom silicon and IP solutions to our customers in data centre, compute, networking, AI, 5G, autonomous vehicles, and storage applications.”
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“Alphawave Semi continues to see growing demand from our hyperscaler customers for purpose-built silicon with very high-speed connectivity interfaces, fueled by an exponential increase in processing of AI-generated data,” said Mohit Gupta, SVP and GM, Custom Silicon and IP, Alphawave Semi.
“We’re engaging our leading customers on chiplet-enabled 3nm custom silicon platforms which include IO, memory, and compute chiplets. Our Virtual Channel Aggregator (VCA) partnership with TSMC has provided invaluable support, and we look forward to accelerating our customers’ high-performance designs on TSMC’s 3nm process.”
Other related 3nm articles
- First PCIe 6.0 and chiplet test chip on 3nm
- TSMC catches Samsung, starts 3nm chip production
- GUC delivers first 3nm, 5nm chips using AI tool
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