Alphawave Semi tapes out first 7nm multi-protocol I/O chiplet

Alphawave Semi tapes out first 7nm multi-protocol I/O chiplet

Business news |
By Nick Flaherty

Alphawave Semi has taped out the industry’s first off-the-shelf multi-protocol I/O connectivity chiplet on TSMC’s 7nm process.

The chiplet combines the Alphawave IP with 800G Ethernet, PCI Express 6.0, CXL 3.x and UCIe (Universal Chiplet Interconnect Express) Revision 1.1. This is aimed at chips for AI data centre and high performance computing cluster designs.

The IO chiplet has a total bandwidth of up to 1.6 Tbit/s with 16 lanes of multi-standard PHY in a combination of mixed operating modes and comes as 0 IP starts shipping.

This paves the way for a robust, open ecosystem using UCIe as a die-to-die connectivity subsystem, says the company. The design uses IP that has already been proven in silicon, but marks Alphawave’s shift from an IP supplier to a silicon supplier. It is also developing a chiplet with ARM Neoverse N3 processor cores that would be an obvious companion for the IO silicon.

“The successful tape-out of this off-the-shelf, multi-protocol I/O connectivity chiplet demonstrates our extensive experience of using the TSMC 3DFabric ecosystem to integrate advanced interfaces and marks another step forward in Alphawave Semi’s mission to deliver ultra-high-performance connectivity for the critical data communications that underpin the world’s digital infrastructure,” said Mohit Gupta, general manager for custom silicon and IP at Alphawave Semi.

 “Our top hyperscaler and datacenter infrastructure customers can quickly and easily mix and match high-performance custom SoCs with our I/O connectivity or memory expansion chiplets, providing a new level of flexibility and scalability for their AI-enabled systems.”

Percy Chang, Director of Emerging Business Development at TSMC, adds “The tape-out of the Alphawave Semi multi-protocol I/O connectivity chiplet built on our 7nm process is another example of how TSMC is playing a critical role in the semiconductor platforms essential to new and emerging high-performance, high-throughput applications. We will continue to work with our VCA partners like Alphawave Semi to foster a robust and open chiplet ecosystem that delivers the high-bandwidth connectivity and compute silicon needed for HPC and AI applications.”


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