Due to their special flow-flavoring fin geometry, the heat sinks provide an excellent thermal effect. Thanks to their outer shape, they ensure less weight and best possible air flow by appropriate design and number of pins. They are suitable for high power applications from 1W up to 5W. The heat sinks are available in several surfaces and plating, automatic assembly procedures are supported by individual packing solutions. The LED board module can be assembled easily onto the heat sinks with e.g. screws.
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