AMD shrinks automotive FPGA package
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AMD is expanding its range of automotive FPGAs with a smaller, cheaper version for ADAS sensor applications and in-vehicle infotainment (IVI).
The AMD Artix UltraScale+ XA AU7P 16nm FPGA has a smaller package with camera vision or in-vehicle display applications and is available in a chip-scale package, designed for increased routing/signal density for I/Os, better solder joint reliability, and enhanced electrical performance.
The 9 x 9 mm package for the FPGA is down from the previous 19 x 19 mm approach, with 81,000 logic cells and 3.8Mbits of memory.
Smaller silicon devices are becoming increasingly prevalent in automotive sensors and digital cockpits. According to the consulting firm Yole Intelligence, the Advanced Driver-Assistance Systems (ADAS) camera market was estimated to be $2bn in 2023 and is projected to reach $2.7bn by 2029.
AMD shows first 7nm automotive FPGA and embedded processor
“As the automotive market expands, optimizing form factor, power, and media processing has become even more critical for automotive OEMs and Tier 1 suppliers,” said Wayne Lyons, Senior Director of Marketing, Automotive Segment, AMD. “With the release of this new, small-form-factor Artix UltraScale+ device, AMD continues its commitment to developing devices that address ADAS and IVI synergy.”
Customers are already designing the Artix UltraScale+ AU7P FPGAs into their ADAS edge devices such as thermal and IR cameras. Automotive designers can use these devices for data ingest and image/video processing for edge sensors. Additionally, these devices can be connected to in-vehicle displays to enhance infotainment features.
More information is on AMD’s Automotive website.
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