Amkor kicks off $7B semiconductor packaging and test campus in Arizona
Amkor Technology has kicked off construction on a massive new $7 billion semiconductor packaging and test campus in Arizona, a project that expands the company’s total planned investment and underscores its commitment to strengthening U.S. chip packaging capabilities. The new development — now including a second greenfield facility and additional cleanroom space — ranks among the largest back-end semiconductor manufacturing investments in the country. Amkor expects the campus to create up to 3,000 high-quality jobs in the region once both phases are complete.
This marks a major milestone in reshoring advanced packaging capabilities to the U.S. — a key part of the semiconductor supply chain that has traditionally been concentrated in Asia. The move opens new opportunities for European suppliers and technology partners connected to AI, mobile, and automotive chip ecosystems.
A cornerstone for U.S. advanced packaging
Located in Arizona’s growing high-tech corridor, the new Amkor campus will become the first high-volume advanced packaging and test facility in the U.S. Amkor expects to complete construction of the first plant by mid-2027 and begin production in early 2028. The site will use smart factory technologies, scalable production lines, and advanced packaging processes to serve major customers such as Apple and NVIDIA.
Artistic conceptual rendering. (Source: Amkor Technology, Inc.)
“This groundbreaking represents a bold step in Amkor’s long-term strategy for growth and innovation,” said Giel Rutten, president and CEO of Amkor. “We’re building a facility to meet our customers’ most advanced needs that will help shape the future of semiconductor manufacturing in the United States.”
The investment is supported by the CHIPS for America Program, the Advanced Manufacturing Investment Tax Credit, and local and state government incentives. With over 750,000 square feet of cleanroom space planned across both phases, Amkor’s Arizona site will anchor an end-to-end semiconductor manufacturing ecosystem alongside TSMC’s wafer fab in Peoria.
Industry and government leaders back expansion
The groundbreaking drew participation from top U.S. officials and semiconductor executives. U.S. Secretary of Commerce Howard Lutnick said, “Our partnership with Amkor will bring high volume advanced packaging to the U.S. for the first time, supporting our leading AI industry capabilities and American innovation.”
Apple’s chief operating officer Sabih Khan added, “Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road.”
NVIDIA founder and CEO Jensen Huang called the project a defining milestone in “bringing this capability home,” adding that “AI has ignited a new industrial revolution — and with it, the chance to reindustrialize America.”
Strengthening the semiconductor ecosystem
With this investment, Amkor is reinforcing its position as a leading outsourced semiconductor assembly and test (OSAT) provider while contributing to U.S. efforts to onshore critical semiconductor manufacturing.
Arizona officials, including Governor Katie Hobbs and Senators Mark Kelly and Ruben Gallego, highlighted the project’s economic benefits and its role in establishing the state as a semiconductor powerhouse. Together with TSMC, Intel, and others expanding in the region, Amkor’s project positions Arizona as a central hub for the next generation of advanced chip production.
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