Amphenol RF introduces ANSYS HFSS 3D component models of PCB connectors
New Products
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By
Jean-Pierre Joosting
The introduction of the 3D model allows the consumer to test a variety of PCB connectors within their design without the need for a physical prototype. These 3D component models are intended to shorten the testing process and afford designers/engineers the opportunity to optimize the return loss performance of their board launch.
ANSYS 3D component models are currently available for the company’s line of SMA High Frequency End Launch Connectors. Additional 3D models are currently in production and will be released shortly.
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