Analog Devices to buy 40nm wafers from TSMC in Japan
Analog Devices (ADI) has negotiated a special arrangement with TSMC for 40nm wafers from its joint venture in Japan.
The ADI deal is with Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan, which opened this week with partners Sony, Denso and Toyota. The deal will support ADI’s wireless BMS (wBMS) and Gigabit Multimedia Serial Link (GMSL) chips.
The joint efforts reinforce ADI’s hybrid manufacturing network which combines in house fab capacity with foundry supply. ADI is expanding its fab in Limerick, Ireland, with backing from the European Commission.
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“Our hybrid manufacturing network helps deliver a competitive edge to our customers. Together with TSMC, we can serve our customers with more resilient supplies, respond even more rapidly to customer needs and changing market conditions, and focus our investments on innovative manufacturing solutions that benefit society and the planet,” said Vivek Jain, Executive Vice President of Global Operations & Technology at ADI.
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JASM plans to start construction of a second fab by the end of this year, providing a total production capacity of more than 100,000 12-inch wafers per month. These will start from 40, 22/28, 12/16 and 6/7nm process technologies for automotive, industrial, consumer and HPC-related applications. The capacity plan may be further adjusted based upon customer demand.
“Today’s announcement demonstrates TSMC’s commitment to helping our customers meet their long-term capacity needs,” said Sajiv Dalal, Executive Vice President of Business Development at TSMC North America. “We’re delighted to expand our ongoing collaboration with ADI that will help to ensure a steadfast and dynamic journey of semiconductor innovation with robust manufacturing capabilities.”
www.analog.com/en/who-we-are/resilient-hybrid-manufacturing.html.
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