Ansys taps Nvidia Omniverse for 3D multiphysics visualization

Ansys taps Nvidia Omniverse for 3D multiphysics visualization

Technology News |
By Nick Flaherty

Cette publication existe aussi en Français

Ansys is using the Nvidia Omniverse to produce real time visualisations of its physics solver for 3D IC designers.

Using Omniverse provides accurate visualisations of EM and thermal package effects for 3D IC designs in 5G/6G, Internet of Things (IoT), artificial intelligence (AI)/machine learning (ML), cloud computing, and autonomous vehicles.

The 3D vertically stacked chip reduce the form factor but have significant challenge for electromagnetic interference and thermal stress effects. It also makes tracing the origins of these problems more difficult. To understand the interactions between 3D-IC components for more advanced applications, 3D multiphysics visualization becomes a requirement for effective design and diagnostics.

Ansys’ integration of the Omniverse APIs for developing OpenUSD- and Nvidia RTX-enabled 3D applications and workflows will deliver the real-time 3D-IC visualization of results from Ansys solvers, including the HFSS, Icepak and RedHawk-SC tools.

This will help designers interact with 3D models to evaluate critical phenomena for electromagnetic fields and temperature variations.

“Advanced manufacturing relies on marrying the physical world with the digital,” said Prith Banerjee, chief technology officer at Ansys. “At Ansys, we are harnessing the power of the Nvidia Omniverse platform to comprehensively simulate and design everything — from tiny semiconductors to the expansive factories where they are produced. Ansys tools, such as RedHawk-SC, already offer visualization features, which are integrated with Omniverse to unlock a new realm of potential.”

In addition to integrating Omniverse, RedHawk-SC is now accelerated by Nvidia’s Grace CPU Superchips, helping it deliver more performant multiphysics designs.

“Accelerated computing, AI physics, and physically based visualization will drive the next era of industrial digitalization,” said Rev Lebaredian, vice president of Omniverse and simulation technology at NVIDIA. “Ansys semiconductor solutions connected to Omniverse Cloud APIs will help accelerate the electronics ecosystem’s design and engineering processes.”

The 3D-IC multiphysics visualization with Omniverse will be shown at the DAC conference in San Francisco next week.


If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :    eeNews on Google News


Linked Articles