Chipmaking equipment vendor Applied Materials (Santa Clara, Calif.) and research institute CEA-Leti (Grenoble, France) have opened a joint lab to address speciality semiconductor developments.
The lab, located at CEA-Leti’s Grenoble campus, is an expansion of existing collaboration on differentiated specialty materials and is intended to support customer needs in IoT, communications, automotive, power and sensors (ICAPS). Technology applications in those fields include photonics, image sensors, RF communications components, power devices and heterogeneous integration.
The joint lab features several of Applied Materials’ 200mm and 300mm wafer processing systems and will host several Applied Materials scientists.
“For the past 10 years, Applied Materials and CEA-Leti have collaborated through multiple, specific joint development programs, which have set the stage for establishing our new joint lab,” said Sébastian Dauvé, the institute’s CEO, in a statement. “Past projects included work in domains such as advanced metrology, materials for memory applications and optical devices, bonding techniques, materials deposition and film growth and chemical-mechanical planarization. Our results brought high value to both partners and to customers around the world, and we look forward to expanding our engagement with this new lab.”
“In addition to developing differentiated technological solutions for Applied’s customers, the work performed at the joint lab will help overcome current technical hurdles in support of CEA-Leti’s internal R&D programs.”