Asahi Kasei to double PSPI production capacity for semiconductors by 2030
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Asahi Kasei plans to double its photosensitive polyimide (PSPI) production capacity for semiconductors by 2030, investing ¥16 billion (€100m) at its Fuji City facility in Japan. The move underscores the company’s commitment to strengthening supply resilience of key semiconductor materials.
For eeNews Europe readers, the expansion highlights both the growing demand for advanced semiconductor packaging materials and the supply-chain strategies that will shape the industry’s next growth cycle.
Meeting surging semiconductor demand
Photosensitive polyimide (PSPI) plays a central role in semiconductor manufacturing, used for buffer coatings, passivation layers, and redistribution layers (RDL) in advanced packaging. With the global chip industry projected to surpass $1 trillion in annual revenue by the mid-2030s, Asahi Kasei is aligning capacity with accelerating market needs.
The company recently completed construction of a new PIMEL™ plant in Fuji City in December 2024, and the new expansion will double that output by 2030. By doing so, Asahi Kasei aims to secure a stable global supply of PSPI, which has become critical in enabling next-generation technologies such as generative AI.
Nobuko Uetake, Senior Executive Officer of Asahi Kasei, said, “The rapid growth of generative AI and other advanced technologies is driving unprecedented demand for semiconductor materials like PIMEL™ PSPI. This investment positions Asahi Kasei to capture that growth by enhancing our supply capability and reinforcing our role as a reliable partner to global semiconductor manufacturers. It supports our broader strategy to build long-term value in high-growth, high-impact sectors.”
Strategic growth and industry recognition
Asahi Kasei has positioned its electronics business in the company’s “First Priority” category, marking it as a growth engine through 2030 and beyond. The company’s strategy, outlined in its medium-term management plan Trailblaze Together, focuses on selected high-growth sectors, with semiconductors topping the list.
PIMEL™ plays a crucial role in semiconductor manufacturing, offering protection, adhesion, and optimized electrical connectivity for advanced packaging. In 2024, TSMC recognized Asahi Kasei’s contributions with its Excellent Performance Award for “Excellent Technology Collaboration and Production Support in Advanced Packaging.”
With a forecasted 8% annual growth rate in demand for interlayer insulation, the expanded PSPI production capacity not only strengthens Asahi Kasei’s market position but also provides chipmakers with greater assurance of material availability at a time when supply stability is a strategic concern worldwide.
https://www.asahi-kasei.com/
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