ASE dominates top 25 ranking of chip packagers

ASE dominates top 25 ranking of chip packagers

Market news |
By Peter Clarke

Even if SPIL and USI revenues are separated from ASE Technology Holding Co., Ltd. and subsidiaries, the former ASE Inc. business revenue was US$5,250 million in 2018 and much higher than second ranked Amkor.

Amkor Technologies and JCET Group showed growth of between 2 and 3 percent while SPIL grew strongly at 5 percent year-over-year, according to Yole analyst Favier Shoo. PTI outperformed with growth of 15 percent YoY

Top 25 OSAT companies by revenue in 2018 (US$million). Source: Yole Developpement.

There were no changed in ranking from 2017 to 2018 among the top five 5 OSATs – ASE, Amkor, JCET Group, SPIL and PTI – according to Yole. However, there were many changes in revenue ranking for the remaining players between 2017 and 2018 estimations.

“Tongfu Microelectronics, Chipbond Technology, SFA Semicon, Inari Amertron Berhard, Sigurd Microelectronics and Hana Micron had achieved high YoY revenue growth and moved up the ladder,” said Santosh Kumar, principal analyst at Yole Korea, in a statement. “Meanwhile, Unisem Berhad, Walton Advanced Engineering, Tong Hsing and Nepes Corporation have dipped in position with negative YoY revenue growth. Ardentec has achieved a good 8 percent YoY but its rank has dropped by a level.”

The leading OSATs continue to make heavy investments in capex and R&D, Yole said. In 2018 the top eight OSATs were responsible for 70 percent of global capex and R&D. This puts smaller players at risk of losing market share and being forced out of a sector that appears ripe for further consolidation.

Geographically, the top 8 OSATs revenue in 2018 now includes three manufacturers with headquarters in China, while Singapore and Japan are left with one OSAT in the top 25. Out of top 25 OSATs, Taiwan-based OSATs contributed more than half of the revenue in 2018 followed by China, US and Malaysia who displaced Korea from 4th position in 2017.

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