
ASIC platform targets automotive chiplets
Alchip Technologies in Taiwan has launched an ASIC and chiplet platform that targets the specialist needs of automotive.
The Automotive platform streamlines the ASIC process for chip, chiplet and module designs but is also of interest to the car makers who have been looking at their own semiconductor design operations following the chip shortages.
Alchip says it is seeing significant interest from companies across Europe, Japan, the United States and Asia. The company has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3DIC design, CoWoS andchiplet design and manufacturing management.
The platform consists of six modules: Design for Autonomous Driving (AD)/ Advanced Driver Assistance System (ADAS), Design for Safety, Design for Test, Design for Reliability, Automotive Chip Sign-off, and Automotive Chip Manufacturing (MFG) Service.
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Design for AD/ADAS integrates Central Processing Unit (CPU) and Neural Processing Unit (NPU) with die area reduction but still meeting the higher performance and lower power consumption required by automotive applications. AIchip works with ARM M, R and A class cores and Mali graphics, as well as DSPs from Ceva and Cadence/Tensilica.
The Design for Safety module follows the ISO26262 pre-scribed flow that includes required isolated TMR/Lock-Step design methodology. The module also features an experienced safety manager and includes the mandated Development Interface Agreement (DIA) that defines the relationship between the manufacturer and the supplier throughout the entire automotive safety lifecycle and activities.
Design for Reliability includes enhanced Electromigration (EM) as part of silicon lifecycle management. It also covers AEC-Q grade IP sourcing and implementation.
The Automotive Chip Manufacturing Service works with IATF16949 approved manufacturing suppliers. Services include tri-temp testing by target AEC-Q grade, automotive wafer, automotive substrate, assembly and burn-in.
Design for Test capabilities support In System Test (IST) and MBIST/LBIST design, critical and redundancy logic for yield harvest, automotive-level ATPG coverage, and physical-aware ATPG.
The final sign-off module covers an aging library based on a customer mission profile, OD/UD/AVS/DVFS library support, and the final Design for Manufacturing sign-off.
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“This is a huge step forward for ADAS and autonomous driving ASIC components and the global automotive electronics industry, said Johnny Shen, CEO of Alchip.” It will speed up the development and time-to-market of essential safety-critical ADAS applications, while significantly advancing the innovation with increasing complex autonomous driving implementation and features.”
Other customers include global leaders in AI, HPC/supercomputer, mobile phones, entertainment device, networking equipment and other electronic product categories.
Access to the new Automotive platform is available now through Alchip offices in Taipei, Silicon Valley, Yokohama, Shanghai, Penang, and its affiliate office in Israel.
