Audio module is based on IC-in-PCB technology
TDK’s SESUB allows for thinned IC die to be included within the layers of a multilayer PCB.
This can even be to the extent that the audio output stage can be integrated with the electromechanics of consumer microspeakers turning the speaker into an independent digital component, or digital speaker.
Trigence’s audio IC module combines volume control, 11-band audio equalizer, audio DSP, Dnote speaker driver, EMI filter, all passive components and a SoundWire interface for computer portable audio applications. Trigence has also integrated several proprietary signal processing algorithms to enhance sound quality and loudness.
Digital Thiele/Small parameter correction (DTSC) offers firmware control over the Thiele-Small characteristics of the loudspeaker, giving the ability to improve the acoustic quality of the speaker, earphone or headphone through real-time digital signal processing. Alternatively, DTSC can be used to match the acoustic characteristics of similar sized speakers from different manufacturing lines.
Trigence also offers Digital-Assist to protect the speaker from damage when driven beyond its typical rated limits. D-Assist does not employ the use of low-frequency probe-tones which degrade the power efficiency of the driving circuitry.
TDK’s SESUB allows for thinned IC die to be included within the layers of a multilayer PCB.
“SESUB allowed us to create the smallest possible Audio ICM, allowing us to develop DSMs not only for desktop size systems but also microspeaker sizes as small as the 16mm by 9mm solutions found in today’s handheld products,” said Pete Birch, CEO of Trigence Semiconductor, in a statement.
Trigence was founded in 2006 as a spin-off from Hosei University and received its first investment in 2012 from Intel Capital. Other subsequent investors include Innovation Network Corporation of Japan, Nittoku Engineering Group and TDK Corp.
Related links and articles:
News articles:
INCJ, Intel back Trigence in digital audio
Intel Capital invests in audio for use in ultrabooks
EE Times Silicon 60: Hot Startups to Watch
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