Automotive BLE 5.4 chip targets wireless battery management systems
Infineon Technologies has added eight BLE Bluetooth devices to its Airoc range, including an automotive SoC for wireless battery management systems (BMS) and car access.
The Airoc CYW20829 BLE Bluetooth Low Energy 5.4 microcontroller (MCU) family includes both System-on-Chip (SoC) devices and wireless modules optimized for wireless BMS and vehicle access designs.
The AIROC CYW89829 Bluetooth Low-Energy MCU, is aimed at car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses).
The dual ARM Cortex M33 core has separate 96MHz application and 48MHz Bluetooth Low Energy subsystem cores alongside a 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.
The part is automotive AECQ-100 Grade 2 qualified with a 105°C operating temperature limit and has 256 KB / 96 KB SRAM and supports up to 8 Mbit of flash with on-the-fly encryption.
The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and other wireless applications.
“Infineon offers one of the industry’s broadest portfolios of IoT solutions. Our Bluetooth solutions offer robust connectivity and the latest features,” said Shantanu Bhalerao, Vice President of the Bluetooth Product Line, Infineon Technologies. “Our automotive CYW89829 BLE MCU, and versatile CYW20829 MCU deliver ultra-low power and a high degree of integration for a better user experience across various applications in automotive, industrial, and consumer markets.”
“The Infineon CYW20829 is the leading Bluetooth part in the market, which has passed the latest Bluetooth 5.4 certification,” said Kevin Wang, CEO of ITON. “CYW20829 has very good RF performance, supports PAwR and LE Audio. These features bring more possibilities in consumer and industrial markets.”
“CYW20829, with perfect RF performance, flexible API, and good long-range features, provides a good solution for commercial lighting, industrial IoT, and more,” said Cai Yi, CEO of Pairlink.
“Earlier this year, the Bluetooth SIG released version 5.4 of the specification with new features: Periodic Advertising with Responses and Encrypted Advertising Data. These features implemented on Infineon’s CYW20829 chips allow Addverb to develop a secure monitoring and controlling system for a fleet of wireless robots in the industrial warehouse, satisfying safety requirements,” said Tapan Pattnayak, Chief Scientist at Addverb, a global leader in robotics.
The CYW89829B0022 is simpaling now in a 40QFN SoC package 6×6 mm, designed for wireless BMS and car access as is the CYW89829B0232 in a 77BGA SoC package, 7×8 mm, suitable for wireless BMS and car access.
The CYW20829B0021 in a 40QFN SoC package, 6×6 mm is suited for industrial and long-range applications
In the second quarter of 2025, samples are expected of the CYW20829B1230, which will be available in a 64 Ball BGA SoC package with a dimension of 4.5×4.5 mm and suitable for wearables, power tools, and asset tracking
Other Airoc BLE products in production are the CYW20829B0000, in a 56QFN SoC package, 6×6 mm, designed for PC accessories, remotes, ESL, and low-end BLE MCUs as well as the CYW20829B0010, packaged in 56QFN SoC with a dimension of 6×6 mm, suitable for gaming accessories and LE Audio products and the CYW20829B0-P4EPI100 and CYW20829B0-P4TAI100 modules, both with a dimension of 14.5×19 mm, suitable for long-range, asset tracking, power tools, and generic Bluetooth LE use cases
Details of the AIROC CYW89829 Bluetooth LE MCU are here.
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