Automotive-grade multilayer ceramic chip capacitors
The new series comprises two lineups of MLCCs with different thermal characteristics: C0G components with a temperature range of -55°C to +125°C and a temperature coefficient of 0 ±30 ppm/°C max., and NP0 components with a temperature range of -55°C to +150°C and the same temperature coefficient.
The material used in the CGA3EA series features a low dielectric constant and thus maintains stable performance even when load conditions such as temperature or voltage change. The new components are therefore able to withstand ESD events of up to 8 kV and higher, as proven by the contact discharge test according to IEC 61000-4-2 (level 4). Mass production of the CGA3EA series, which is qualified to AEC-Q200, started in October 2013.
Development of the new MLCCs was made possible by TDK’s know-how in a range of sophisticated technologies, including the pulverization of dielectric materials, high-dispersion processing, and both thin-layer and multilayer technology for dielectric ceramics. As a result the CGA3EA series are able to offer reliable ESD protection in a wide range of automotive electronics applications such as airbag controllers, remote keyless entry systems, navigation systems and more.
Main applications include input and output sections of a wide range of automotive applications such as airbag controllers, remote keyless entry systems, and navigation systems.
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