The new products provide the fast system startup and higher data bandwidth required for in-vehicle infotainment systems and instrument clusters. Micron UFS 2.1 compliant managed NAND storage solutions deliver these specifications with automotive-grade reliability using cost-effective 64-layer 3D TLC NAND architecture. Micron’s UFS 2.1 products deliver up to treble the sequential read performance of the company’s e.MMC-based products, bringing instant-on capability and improved responsiveness.
Key Features
Superior performance: Up to 940 MB/s reads and 650 MB/s writes, UFS delivers up to 3X faster reads and more than 2X faster writes than e.MMC interfaces
Operating temperature: -40 to 105 C and -40 to 95 C2
Quality and reliability: AEC-Q100, IATF 16949-compliant
Cost-effectiveness: Based on industry-leading 64-layer TLC NAND with CMOS under array technology
More information
https://www.micron.com/solutions/automotive
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