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Automotive ultra-low On-resistance MOSFET in thermal-improved package

Automotive ultra-low On-resistance MOSFET in thermal-improved package

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By Christoph Hammerschmidt



The TPWR7940PB is a 40V max 0.79mΩ MOSFET in DSOP Advance(WF)L package, while and the TPW1R104PB is a 40V max 1.14mΩ MOSFET in DSOP Advance(WF)M package. Both DSOP Advance package types are 5mm x 6mm packages with 8 pins.  They differ in their exposed surface area of the top metal plate. The top exposed area is about 8mm2 in DSOP Advance(WF)M and about 12mm2 in DSOP Advance (WF)L. Measured in Toshiba’s test environment, the maximum channel-to-top-plate thermal impedance is 1.5K/W for the TPW1R104PB and 0.93K/W for TPWR7940PB. Their excellent thermal performance is achieved by attaching the top exposed area to a heatsink (such as a metal frame) via an insulating layer.

The DSOP Advance (WF)M and DSOP Advance (WF)L packages are footprint-compatible with an SOP Advance (WF) package that has no exposed top metal area. The DSOP Advance (WF)M and DSOP Advance (WF)L packages employ a wettable flank terminal structure that enables AOI(Automated Optical Inspection) of solder joints on PCBs. AOI is especially important in automotive applications where verification of soldering quality is required.

Series production for both MOSFET types has already started.

More information https://toshiba.semicon-storage.com/eu/top.html

 

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