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Beam-forming LED modules shrink further: wafer-level lenses will come next

Beam-forming LED modules shrink further: wafer-level lenses will come next

New Products |
By Julien Happich



The Plessey Orion LED beam forming modules deliver a compact 3000 lumen beam from a tiny module which can be as little as 5.6mm thick, less than one-tenth the thickness of standard alternatives. The recently launched PLWS3000 25° FWHM beam angle module has now been joined by modules with 15° and 50° beam angles. All modules in the family share a common 82mm diameter, allowing lighting designers to simply and easily substitute modules to create a family of compact luminaires suitable for a wide range of lighting applications.

The company also plans to release Orion-Mini, a 45mm diameter version offering a 10° sub 1000 lumen beam in Spring next year. The Orion-Mini will share the slim profile of the full size module, but will be offered in a format suitable for design into small form-factor downlights, spotlights and architectural lights as a replacement for GU10, MR16 and similar lights.

For now, the thickness of the beam-forming heat-sinking plate also serves as the necessary reflective beam collimator (with conical-shaped holes positioned in front of each LED die), but Plessey is actively working on wafer-level lenses to perform a similar beam-forming function, something it hopes to bring to market in the course of next year.

The Orion family of modules is offered in three colour temperatures: warm white, neutral white and cool white. The modules have a luminous efficiency of over 100 lumens/Watt, feature an improved light uniformity and excellent thermal performance.

Visit Plessey Semiconductors at www.plesseysemiconductors.com

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