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Bias power supply module integrates transformer, halves footprint

Bias power supply module integrates transformer, halves footprint

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By Christoph Hammerschmidt



With the electric vehicle (EV) market gaining momentum, design engineers are looking for ways to increase the efficiency and reliability of their cars while reducing the weight of the powertrain. To meet the demand for smaller, more reliable systems to increase the range of EVs, there is an increasing reliance on a distributed power supply architecture in which each isolated gate driver is assigned its own bias power supply. This improves the system’s response to individual failures. For example, if one bias power supply fails, the others and their associated gate drivers remain functional so that the vehicle can continue to safely participate in traffic.

Fully integrated power solutions such as the UCC14240-Q1 module help developers take advantage of the benefits of distributed architecture. The product’s economies of scale and efficiency enable higher power density and system efficiency, allowing vehicles to travel longer distances between charges. The UCC14240-Q1’s low profile of only 3.55 mm and small footprint make it possible to reduce the volume of the power solution by up to 50%, allowing more power to be accommodated in half the space.

The dual-output module achieves 60%, twice the efficiency of traditional bias power supplies, also doubling power density and helping to extend the vehicle’s operating range. The UCC14240-Q1 provides more than 1.5W at ambient temperatures up to 105°C and can therefore be used to drive silicon carbide (SiC)- and gallium nitride (GaN)-based IGBTs (insulated gate bipolar transistors) and switches at high frequencies.

Thanks to the integrated transformer technology, the UCC14240-Q1 module can contain electromagnetic interference due to fast switching processes and achieve a CMTI (Common-Mode Transient Immunity) value of over 150 V/ns.

With its smooth switching, spread-spectrum modulation, shielding and low parasitics, the device enables designs to meet CISPR 25 and CISPR 32 (Comité International Spécial des Perturbations Radioélectriques) EMC standards with less effort, enabling faster time to market.

The UCC14240-Q1’s built-in regulation allows an accuracy of ±1.0% at temperatures from -40°C to +150°C. This tight tolerance allows the use of smaller circuit breakers and improves overcurrent protection. Failure monitoring is fully integrated, as is overcurrent, overload and overtemperature protection. The UCC14240-Q1 module offers an insulation voltage of 3 kVrms and has the highest vibration resistance in the industry.

The UCC14240-Q1 module is available from TI in a 12.8 mm x 10.3 mm x 3.55 mm shrink small-outline 36-pin package in pre-production quantities. Prices start at 4.20 US dollars (from 1,000 units). In addition, for evaluation purposes, the UCC14240Q1EVM-052 evaluation module is available on TI.com for $59.

www.ti.com/UCC14240-Q1-pr-eu

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