Bluetooth 5.2 SoC in 2.48×2.46mm WLCSP

Bluetooth 5.2 SoC in 2.48×2.46mm WLCSP

New Products |
By Julien Happich

The nRF52805 is an ultra low power Bluetooth Low Energy (Bluetooth LE) SoC supplied in a wafer level chip scale package (WLCSP) measuring just 2.48×2.46mm. The WLCSP SoC is optimized for two-layer PCB designs – eliminating the need for more expensive four-layer PCBs to significantly cut costs in compact, budget-constrained designs. The SoC is capable of Bluetooth LE high-throughput 2 Mbps and enhanced Channel Selection Algorithm #2 (CSA #2) for improved coexistence.

The chip features a powerful 64-MHz 32-bit Arm Cortex-M4 processor (144 CoreMark) with excellent efficiency (65 CoreMark/mA) and includes 192KB Flash plus 24KB RAM. The multiprotocol (Bluetooth LE/2.4GHz) radio offers up to +4dBm power output and -97dBm sensitivity (1 Mbps Bluetooth LE) for a link budget of 101dBm. The radio’s peak power draw is only 4.6mA (TX 0dBM, RX 1Mbps) and the SoC’s current draw is as low as 0.3µA in System OFF and 1.1µA in System ON with 24KB RAM retained and RTC running. The SoC features a range of analog and digital interfaces such as SPI, UART, and TWI, a two-channel 12-bit ADC, and ten GPIOs. Nordic offers a 9.5 x 8.8mm reference layout with all ten GPIOs available, which requires only ten external passive components (including two crystal load capacitors). The SoC can be powered from a 1.7 to 3.6V supply and integrates LDO and DC/DC voltage regulators.

Nordic Semiconductor –

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