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Bluetooth LE SoC is only 2.0×1.7mm

Bluetooth LE SoC is only 2.0×1.7mm

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By eeNews Europe



The Bluetooth LE SoC, also known as SmartBond TINY, is currently in production and can add BLE functionality to an application for as little as $0.50 in high volumes. Measuring only 2.0×1.7mm, SmartBond TINY enables a complete system cost reduction of IoT devices through a smaller footprint and size, while maintaining performance quality at a level unmatched by its competitors, according to Dialog. The DA14531 makes it possible to extend wireless connectivity to applications where it would have previously been prohibitive in terms of size, power or cost. SmartBond TINY is based on a powerful 32-bit ARM Cortex M0+ with integrated memories and a complete set of analog and digital peripherals, delivering a record score of 18300 on the latest IoTMark-BLE, the EEMBC benchmark for IoT connectivity. Its architecture and resources allow it to be used as a standalone wireless microcontroller or as an RF data pipe extension for designs with existing microcontrollers.

The SmartBond TINY module, built around the DA14531 chip, makes it easy for customers to leverage the new SoC as a part of their product development. TINY’s record-low power consumption ensures a long operating and shelf life, even with the smallest of batteries. The DA14531’s integrated DC-DC converter enables a wide operating voltage (1.1 to 3.3V) and can derive power directly from environmentally-friendly, disposable silver oxide, zinc air or printable batteries required for high-volume applications, such as connected injectors, glucose monitors and smart patches.

Dialog Semiconductor – www.dialog-semiconductor.com

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