Bluetooth module minimises current consumption in tiny footprint
The PAN B511-1C is a small, cost-effective Bluetooth module from Panasonic Industry that offers high performance and a large memory capability. It minimises current consumption and is based on the Nordic nRF54L15 single-chip controller.
The Bluetooth module provides access to all 32 GPIOs of the controller chip with a dedicated number of GPIOs positioned at the edge of the module, with the rest located at the bottom pad. Despite its hybrid packaging of castellated holes and LGA, the module is as small as a 2-cent coin, delivering one of the best pin-to-size ratios for Bluetooth modules currently on the market. Its edge pins facilitate easier hand-soldering and support the use of inexpensive 2-layer PCB designs and optical inspection methods, eliminating the need for costly X-ray machines.
The module features an embedded microcontroller and ARM Cortex-M33 with a large amount of memory — 1.5 MB flash memory and 256 kB RAM.
Tomislav Tipura, Product Manager at Panasonic Industry comments: “Our latest PAN B511-1C Bluetooth module features very complex and sophisticated algorithms. We also offer three different spec variants to enable a variety of applications. The modules are, for example, available with additional integrated slow clock crystal for energy efficient battery-powered operation and additional 4 MB flash memory for more complex applications.”
An output power of 8 dbm makes the module ideal for the European market. Target applications include lighting, home appliances, industrial sensors, medical devices, healthcare wearables, energy management devices and solar farms. Furthermore, the PAN B511-1C is ideally suited for Matter applications, as it comes equipped with additional flash memory and is fully compatible with the PAN MAX Service that facilitates the production and launch of Matter production. The module will be available in three distinct specified variants to cater to diverse project needs.
The PAN B511-1C Bluetooth module will be certified for CE RED, FCC, ISED and MIC. Samples are already available now, with mass production scheduled for June 2025.
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