Bluetooth Smart SoCs gain application-optimised versions for IoT
Dialog Semiconductor has augmented its SmartBond family of ultra-low power, Bluetooth Smart System-on-Chip (SoC) integrated circuits with devices aimed at high volume, high growth consumer markets, claimed as the smallest and lowest power wireless connectivity solutions for the Internet-of-Things (IoT). Versions are optimised for wireless charging and remote control units (RCUs).
The DA14581 is optimised for loosely coupled, highly resonant inductive charging based on the A4WP standard. In order to guarantee charging in all conditions, even when the battery is dead, the DA14581 is capable of booting up in under 50 msec when used in the Power Receiving Unit. When used in the Power Transmitting Unit, the optimised device can track and control the charging of eight devices simultaneously. Optimised code for HCI, which provides standardised communication between the host stack and controller, can now be programmed into One-Time-Programmable (OTP) memory enabling users to create pre-programmed HCI products to be used with external microcontrollers and third-party stacks.
Integrating an analogue audio codec with native support for microphones, the DA14582 is optimised for RCUs that use voice recognition, motion and gesture recognition to control next-generation Smart TVs and set-top boxes. As set-top boxes and smart televisions begin to have built-in Wi-Fi and Bluetooth Smart functionality, Bluetooth Smart is replacing Bluetooth Classic in remote controls due to lower power consumption and reduced connection latency.
The third new device, the DA14583, is a SmartBond SoC with 1 Mbit (128 kByte) of flash. This memory variant of the DA14580 enables customers to keep their deployed products up-to-date through software upgrades Over The Air (OTA). The part is pin-compatible with the DA14580 OTP version. This provides designers with a cost reduction path from flash to OTP once they have matured their application software, particularly if they need OTA upgrades during the initial phase of development and production.
SmartBond SoCs integrate a Bluetooth low energy radio with an ARM Cortex-M0 application processor and intelligent power management. Needing only five external components for a complete standalone Bluetooth Smart solution, the devices offer system integration combined with lowest power consumption. The device’s ARM Cortex M0 processor and full set of digital and analogue peripherals are accessible via up to 32 GPIOs.
SmartBond development kits come with a power profiler, to enable power-optimised coding, and Dialog’s SmartSnippets software development environment, which is based on Keil’s µVision tools. The kits include example application code for both embedded and hosted modes to accelerate product development.
Dialog Semiconductor; www.dialog-semiconductor.com
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