Board-to-board connector market moves toward $16B by 2030
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The global board-to-board connector market is set for steady expansion, moving from $12.42 billion in 2025 to $16.05 billion by 2030, according to new research from MarketsandMarkets. Driven by increasingly compact and complex electronics, these connectors continue to play a critical role in ensuring high-integrity signal and power transfer between PCBs.
For eeNews Europe readers, the board-to-board connector market growth seems to indicate that design priorities are shifting. But where? The shift appears to be toward higher density, faster transmission, and rugged solutions that align with next-gen systems in 5G, automotive, industrial, and high-performance computing markets.
Consumer electronics leads connector demand
Unsurprisingly, consumer electronics remains the largest vertical driving connector adoption. Smartphones, wearables, gaming systems, and laptops require fine-pitch, low-profile connectors that deliver both miniaturization and speed. High production volumes, fast product refresh cycles, and the continued rise of 5G-enabled and IoT-equipped devices create sustained demand.
With manufacturing concentrated in Asia Pacific (particularly in China, Japan, South Korea, and Taiwan), the sector benefits from strong production ecosystems and expanding global consumption of portable, connected devices. The report notes that consumer electronics will account for the largest market share by 2030.
Backplane connectors grow fast
While consumer electronics drives volume, the backplane connector segment is expected to post the highest CAGR through 2030, the report indicates. These connectors are essential to high-speed, high-density environments including data centers, telecom infrastructure, and industrial automation systems.
As 5G infrastructure scales, cloud computing grows, and AI-driven architectures demand ever-greater bandwidth, backplane connectors offer high-bandwidth performance, improved thermal characteristics, and robust signal integrity. These qualities make them a natural fit for servers, switches, and modular high-performance systems.
Asia Pacific takes the lead
From 2025 to 2030, Asia Pacific is poised to accelerate faster than any other region, the report indicates. The presence of leading electronics manufacturers, government investment in semiconductor capabilities, and rapid adoption of EVs and automation technologies all contribute to the region’s momentum.
Countries such as Japan, South Korea, China, and Taiwan continue to dominate global electronics manufacturing, and the demand for compact, high-performance connectors reflects the region’s ambitious build-out of next-gen devices and networks.
Key Industry Players
According to the report, the board-to-board connector landscape includes major global suppliers such as TE Connectivity (Ireland), Amphenol (US), Hirose Electric (Japan), Molex (US), Japan Aviation Electronics Industry (Japan), Samtec (US), CSCONN (China), Omron (Japan), Kyocera (Japan), FIT Hon Teng (Taiwan), and HARTING (Germany). These companies continue to invest in high-frequency, high-speed, and miniaturized interconnect solutions aligned with emerging communications, computing, and automotive applications.
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