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Board X-ray inspection boost with 3D algorithm

Board X-ray inspection boost with 3D algorithm

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By eeNews Europe



Optimization the imaging chain in combination with an improved axle system and faster execution of the test algorithms results in significant savings of cycle time depending on the maximum resolution and the board dimensions, says the company.

As an example, a 216x164mm assembly with more than 8000 solder joints requires only about 40 seconds for complete 3D X-ray inspection. The X-Line 3D enables the safe inspection of double-sided boards. The three-dimensional X-ray inspection captures both top and bottom sides within a single pass. Based on a real time multi-angle image, recording a complete 3D inspection of the assembly is possible.

Integrated reconstruction methods based on digital thomosynthesis enables the defined evaluation of individual layers of the circuit board under test. All the company’s existing X40 Systems of the Series 200 can benefit from the upgrade.

Visit Goepel electronics at www.goepel.com

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