Bonder handles microLEDs on multiple substrates
Next-generation LED technologies have the potential to further enhance performance, improve efficiency and reduce the size of existing lighting technologies. Significant high-volume end-markets including automotive, display, consumer electronics and general lighting are expected to use the technology, which requires highly accurate measurement and placement at speed. While micro and mini LED benefits are compelling, high-volume placement challenges needed to be addressed prior to widespread market adoption of these emerging lighting solutions.
The Pixalux is the first result of a joint development partnership with Indiana-based Rohinni in May to directly address this challenge to provide high throughput and highly accurate placement on multiple substrate types for chip scale devices. The wafer magazine supports 10 wafer carriers and one-step automatic wafer loading.
“We are excited to announce PIXALUX, an innovative cost-effective high speed mini LED placement solution,” said Chan Pin Chong, Kulicke & Soffa’s Senior Vice President of Wedge Bond & EA/APMR Business Unit. “An example of one of the applications we anticipate PIXALUX initially enabling is the development of 2D LCD display backlighting which means thinner and lighter display products that will provide better performance, dynamic range (HDR) and efficiency, improving the overall experience of LCD displays for the consumer.”
“Our partnership with K&S is another big step forward for the Rohinni team and our technology,” said Matt Gerber, CEO of Rohinni. “The scale, capabilities and reach of K&S coupled with Rohinni’s advanced mini-LED placement technology means customers around the world now have a viable path to develop and manufacture next generation mini-LED based products.”
Customer evaluations of the bonder will commence in October 2018.
If you enjoyed this article, you will like the following ones: don't miss them by subscribing to :
