Boreas puts piezo-driver IC in wafer scale package

Boreas puts piezo-driver IC in wafer scale package

New Products |
By Peter Clarke

This chip is intended for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless martphones, smartwatches, game controllers and other battery-powered devices.

In its WLCSP packaging the chip the BOS1901CW measures 2.1mm by 2.2mm by 0.6mm. Boreas Technologies Inc. (Bromont, Quebec, Canada) claims it consumers one-tenth the power of its nearest piezoelectric (piezo) competitor, making it small and low-power enough for the most resource-constrained devices.

Boreas said that Tactai Inc. (Waltham, Mass.) a provider of haptic platforms has used the BOS1901CW to develop a digital active-stylus reference design.

“From digital pens that simulate the feel of writing on paper to touch-enabled buttons and keyboards, users want natural tactile feedback when they’re interacting with their personal electronic products,” said Jonathan Fiene, chief technology officer of Tactai, in a statement issued by Boreas. He continued: “With its small size, straightforward digital interface, and amazing power profile, Boréas’ BOS1901CW allows Tactai to deploy our unique real-time dynamic rendering system into a wide range of new and exciting next-generation piezoelectric-driven mobile and handheld haptic devices.”

Boreas claims the BOS1901CW consumes between 25 percent and 5 percent of alternative technologies such as eccentric rotating mass (ERM) and linear resonant actuator (LRA) with a startup time of less than 300 microseconds.

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