Boreas raises funds to scale haptic driver chip production

Boreas raises funds to scale haptic driver chip production

Business news |
By Peter Clarke

Piezoelectric driver IC developer Boreas Technologies Inc. (Bromont, Canada) has raised US$12 million in Series B funding and expanded its management team.

Boreas was founded in mid-2016 and received seed funding in March 2017. Boreas said it would use the Series B money to move to high-volume production of its piezoelectric haptic semiconductors for mobile, PC and automotive applications.

“This infusion of capital will help catapult our company to the next level, ensuring that we can meet the high-volume demand for our chips in smartphones, PC trackpads and automotive cockpits,” said Simon Chaput, founder and CEO of Boreas, in a statement.

Boreas’ CapDrive piezo drivers enable localized haptic feedback as well as integrated force sensing in applications such as smartphones, where solid-state buttons are replacing legacy mechanical buttons.

The company also announced the appointment of Todd Whitaker, as vice president of products and strategy and Hans Tian, as vice president of sales.

Whitaker is a seasoned general manager who has previously led the global marketing function for two multibillion-dollar semiconductor companies. Tian is the former vice president of sales at TDK InvenSense China and previous to that held a role in sales at Knowles.

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Boreas haptic sensors support games on smartphones

UK haptics startup changes name to Ultraleap

Boreas to provide haptics for PC trackpads

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