C-V2X/DSRC chipset certified for US deployment

C-V2X/DSRC chipset certified for US deployment

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By eeNews Europe

In the US, Autotalks’ V2X chipsets achieved Federal Information Processing Standard 140-2 (FIPS 140-2) security level 3 certification from the US National Institute of Standards and Technology (NIST). Autotalks’ Craton2 and Secton embedded Hardware Security Module (eHSM) is the first V2X HSM to achieve this certification. FIPS 140-2 is a US government computer security standard that is used to approve cryptographic modules. The US Department of Transportation strongly urges FIPS 140-2 level 3 certification for V2X HSM in order to prevent the theft of security credentials. 

According to Autotalks, the certification makes the company’s chipsets the only secure C-V2X/DSRC chipsets ready for deployment in the US, said Yaniv Sulkes, Autotalks’ VP of Business Development and Marketing in North America and Europe. “In the midst of regulatory uncertainty about V2X technology and spectrum in the US, our solution allows automakers to deploy Autotalks’ secure V2X chipset using either V2X technology, with the option to later change to another technology, thus eliminating risk of wrong technology selection.” 

The chipset at hand isolates V2X from the non-safety domains, thus providing domain separation & security, scalability, and cost-optimizations of Telematic Control Unit (TCU) deployments. The embedded HSM exceeds the secure storage size defined by US DOT V2X NPRM, assures access to secure assets only by authorized processes and includes crypto-agility for future-proof cyber defense. The isolation of V2X, combined with Autotalks’ recognized cybersecurity leadership, enables a secure platform.

A few weeks ago, Autotalks showcased its chipset’s conformance to the Chinese C-V2X standard and the Chinese OSCCA security standard in the first-ever large-scale interoperability demonstration of multi-brand C-V2X communication. The demon brought together over 20 automotive companies including leading automakers, all major chipmakers, and terminal and security solution providers working together in a real-world setting. The IMT-2020/CAICV/China SAE 2019 C-V2X “Four Layers” Interoperability Application Demonstration was part of the China SAE Congress and Exhibition in Shanghai.

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