Leopard Imaging has developed a camera module based on Valens Semiconductor’s MIPIA-PHY chipset that enables automotive OEMs and Tier 1 vendors to significantly reduce time-to-market for their A-PHY-based systems.
Since its release by the MIPI Alliance, the A-PHY standard, which was also adopted by the IEEE (Institute of Electrical and Electronics Engineers) in 2021, has gained momentum in the automotive industry. Numerous automotive OEMs, Tier 1 and Tier 2 companies are currently evaluating Valens’ A-PHY compatible VA7000 chipsets for possible integration into their ADAS platforms.
With this in mind, Leopard Imaging now plans to offer a new product with this A-PHY chipset. The product is the first off-the-shelf A-PHY camera module available on the market and is designed to simplify the integration of MIPI A-PHY and Valens VA7000 chipsets in cars. The camera module contains an automotive image sensor. It is offered in combination with an A-PHY deserializer board connected to a standard processor-based computing unit. Leopard Imaging plans to add additional sensors and drivers to support other processors, which will use Valens’ VA7000 chipsets, depending on market needs.
“We have seen strong demand for MIPI-A-PHY-based connectivity solutions. That’s why it was so important for us to work with Valens Semiconductor to integrate the capabilities of the VA7000 A-PHY chipset into our camera module portfolio,” commented Bill Pu, CEO of Leopard Imaging. “This connectivity standard offers a number of important technological breakthroughs – including bandwidth, transmission distance and electromagnetic interference (EMI) resistance. All of this fuels our expectation that this module will generate significant interest from our customers and partners in the automotive industry.”
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