The new DFN1412D-3 and DFN1110D-3 leadless DFN packages with side-wettable flanks occupy 80% less PCB space than traditional SOT23 and SOT323 packages. Despite this, products assembled in this package feature improved thermal behaviour due to a larger internal lead frame that includes a heatsink and thermal pad.
PESD2CANFDx diodes are also very ESD robust delivering excellent system level protection performance. This is because the parts have industry’s lowest clamping voltages of only 33 V at IPP = 1 A and low dynamic resistance of 0.7 Ω. Nexperia ESD protection devices also offer good RF switching parameters featuring a mixed mode insertion loss of just +20 dB at 300 MHz, leading to excellent signal integrity.
Besides CAN-FD, capability, another essential requirement for automotive applications is the ability to use AOI. The devices at hand, in leadless packages, meet both these requirements, providing a high-performance alternative to leaded SMD packages.
20 devices are available now in the DFN1412D-3 and DFN1110D-3 packages for automotive and industrial applications including CAN/CAN-FD, FlexRay, SENT and LVDS.