CEA-Leti forms common lab with IPDiA to focus on 3D-integrated passive components
The partnership also will pave the way to improved miniaturization of passive components such as resistors, capacitors and inductors. Specifically, the common lab is designed to develop very high-end passive components on silicon that will resist harsh environments, but also functional sub-mounts for lighting components and innovative assembly technologies allowing ultra-miniaturization of future products. IPDiA was founded in 2009 and the company’s two axes of focus are integrated devices for high brightness LEDs and integrated passive devices for new medical, industrial, aerospace and defense markets.
CEA-Leti’s expertise in 3D technologies will allow IPDiA to go beyond the third generation of Passive Integration Connecting Substrate (PICS) components (250nF/mm²), which are being produced at IPDiA’s Caen site, and pursue the development of a future generation of PICS components (1µF/mm², then 2µF/mm²) and their assembly.
These products are designed, developed and manufactured by IPDiA in its production unit.
Visit CEA-Leti at www.leti.fr
Visit IPDiA at www.ipdia.com
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