CEA-Leti launches FAMES pilot line project
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CEA-Leti has started a pilot line for next generation low power and sensor process technologies.
The FAMES Pilot Line will develop five new sets of technologies, from 10nm and 7nm FD-SOI, embedded non-volatile memories and small inductors to develop DC-DC converters for Power Management Integrated Circuits (PMIC).
As well as OxRAM, FeRAM and MRAM embedded memories, the FAMES pilot line will support two 3D integration options (heterogeneous integration and sequential integration), as well as RF components including switches, filters and capacitors.
- Four pilot lines for the EU chip joint undertaking
- Leti details move to 10nm, 7nm FD-SOI process in Europe
The FAMES pilot line is backed by the EU Chips Joint Undertaking and a number of member states, along with 43 companies throughout the electronic-systems value chain, from materials providers and equipment manufacturers to fabless companies, EDAs, IDMs and system houses formally expressing support.
Stakeholders will have access to the line in Grenoble, France, and end-users come from IT, automotive, medical device or space and security markets. Leti is coordinating the FAMES consortium along with imec (Belgium), Fraunhofer Mikroelektronik (Germany), Tyndall (Ireland), VTT (Finland), CEZAMAT WUT (Poland), UCLouvain (Belgium), Silicon Austria Labs (Austria), SiNANO Institute (France), Grenoble INP-UGA (France) and the University of Granada (Spain).
The five new technologies will create market opportunities for low-power microcontrollers (MCU), multi-processor units (MPU), cutting-edge AI and machine learning devices, smart data-fusion processors, RF devices, chips for 5G/6G, chips for automotive markets, smart sensors and imagers, trusted chips and new space components.
“By integrating and combining a set of cutting-edge technologies, the FAMES Pilot Line will open the door to disruptive system-on-chip architectures and provide smarter, greener and more efficient solutions for future chips. The FAMES project will indeed pay special attention to semiconductor sustainability challenges,” said Jean-René Lèquepeys, CTO of CEA-Leti.
“The Chips Joint Undertaking (Chips JU) is proud to contribute to this strategic initiative and strengthen the EU’s sovereignty in a critical domain. This pilot line will advance essential semiconductor technologies, while maintaining a strong focus on sustainability, and foster the collaboration between several European actors. The Chips JU aims to act as a catalyst and a model for further public and private collaborations in key areas,” said Jari Kinaret, the Chips JU executive director.
Leti is holding its Innovation Days this week in Grenoble, detailing its latest technologies and spinouts.
For more about the FAMES partners, click here.
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