CEA-Leti promotes LETI-3S (Silicon Specialty Solutions) collaboration mode on 200mm and 300mm platforms
Technology News
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eeNews Europe
Other entities should be concerned such as foundries or research centers with a limited processes offer, micro and nanotechnologies companies who don’t want low-volume activities, and high-value silicon wafers dealers.
3S addresses following main domains:
- – Deposition
- – Front Side/Back Side cleanings, wet etch and stripping
- – Lithography with dual side alignment capability. LETI-3S can provide generic masks but usually works on customer designs adapted to CEA-Leti lithography tools.
- – Etching
- – Implantation, epitaxy, diffusion
- – CMP, bonding, grinding, dicing
- – Advanced in-line metrology
LETI-3S is operated on the Minatec Campus in Grenoble on 24/7 200mm and 300mm technological platforms. Lower wafer sizes should be available thanks to an innovative holder technology. LETI-3S can provide substrates or work on customers wafers, pre-processed or not, through stringent contamination protocols. LETI-3S ensures a full traceability from process flow conception to products delivery.
Visit CEA-Leti at www.leti.fr/en/How-to-collaborate/Collaborating-with-Leti/Leti-3S
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