
China’s Unisoc ships Imagination AI in 5G chip
Unisoc is using the PowerVR AX3596 (Seires3NX) NNA core, launched in 2018, for the Tanggula T770 and T760 system-on-chips (SoCs), its new smartphone 5G platforms. Architectural enhancements including lossless weight compression improve the performance of the core by 40 percnt in the same silicon area over the previous generation, and helping SoC manufacturers have a nearly 60 percent improvement in performance efficiency and a 35 percent reduction in bandwidth.
- Imagination IP in Chinese AI integration
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“The cooperation between Unisoc and Imagination has a long history. Imagination’s industry-leading technologies in AI and graphics processing are the guarantee for our continuous cooperation,” said Eric Zhou, SVP at Unisoc. “The integration of Imagination’s Series3NX NNA technology into the Tanggula T770 and T760 is another significant milestone of cooperation between the two parties. We look forward to more strategic cooperation with Imagination in the future, to jointly drive the rapid intelligent upgrade for mobile, consumer electronics, IoT, industry and other fields.”
The Series3NX supports both single core and multi-core designs and runs from 0.6 to 10TOPS of performance in a core. The AX3596 core used by Unisoc is the highest performance single core product. The multi-core design can scale to up to 160 TOPS for Advanced Driving Assistance System (ADAS) applications.
“As a leading global supplier of core chipsets in mobile communications and the IoT, Unisoc is showing its determination to innovate to the whole industry, and the latest Tanggula T770 and T760 5G smartphone platforms are proof of that. We are pleased that our neural network acceleration cores can enable these three SoCs to achieve the most efficient AI performance,” said Chris Porthouse, Chief Product Officer at Imagination Technologies.
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