Chinese compound semiconductor foundry achieves automotive standard

Chinese compound semiconductor foundry achieves automotive standard

Business news |
By Peter Clarke

Sanan, a six-inch compound semiconductor wafer foundry, was founded in 2014 and develops and provides GaAs, GaN, SiC, and InP epitaxial wafers and substrates with its state-of-the-art III-V semiconductor fabrication facilities. Sanan can create circuits for gallium arsenide (GaAs) HBT, pHEMT, BiHEMT, integrated passive device (IPD), filters, gallium nitride (GaN) power HEMT, silicon carbide (SiC), and indium phosphide (InP) intended for RF, millimeter wave, power electronics, and optical communications markets.

Among the various applications for these process technologies is automotive such as for vehicle-to-everything (V2X) communications, collision-avoidance sensors, hybrid/electric vehicle (HEV/EV) charging and motor drives.

With IATF 1694 compliance, Sanan IC’s customers are able to meet the automotive industry’s stringent quality system requirements.

To mitigate information and intellectual property (IP) protection concerns, ISO27001 compliance facilitates best-practice for an information security management system (ISMS). It sets guidelines for implementing and monitoring security measures as well as for risk management of both the company’s and customers’ proprietary information and IP.

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